SMIC 65-nm Technology Successfully Moves to Volume Production

 

    SHANGHAI, Aug. 3 /PRNewswire-Asia/ -- Semiconductor Manufacturing International Corporation ("SMIC", NYSE: SMI and HKSE: 981), a world leading semiconductor foundry and the most advanced in Mainland China, announced today that its Low Leakage 65-nanometer (nm) technology, implemented at SMIC's 300mm facility in Beijing, has successfully moved to Volume Production Stage. The 65-nm accumulative wafer shipment has achieved over 10,000 pieces since its mass production began in Q3 2009.

    With more than ten customer -both FOT (Foundry Owned-Tooling) and COT (Customer Owned-Tooling) - in development and production, SMIC's 65-nm logic technology provides higher levels of integration and performance improvement with low power consumption and significantly smaller size. Currently engaged applications include Wi-Fi, Bluetooth, HDTV, AV-decoder, TD-SCDMA chips, and application processors. The 65-nm process is supported by SMIC's design services group which adheres to a rigid design methodology, featuring DFM-compliant products and services. In addition to SMIC's in-house IP and library, 3rd party solutions are also available on the 65-nm technology node. The comprehensive IP solution offers customers a number of advantages in flexibility to streamline the design flow, reduce design investment and improve time to market.

    The transition from 65-nm to 55-nm technology is also being developed, the 55-nm technology is a 90% linear-shrink process from 65nm including I/O and analog circuits. "SMIC's 65-nm can take designs at 65-nm and aim it toward the advantages of 55-nm, I'm delighted with the progress of SMIC's 65/55-nm project team which continues to meet rigorous deadlines," said Chris Chi, Senior Vice President and Chief Business Officer of SMIC. "Our 65-nm technology provides our leading customers unprecedented opportunities to further consolidate their leadership positions in their respective industries. The significant decrease in size, improvements in power consumption, higher speed, lower leakage enable SMIC clients to bring highly differentiated products to the marketplace."

    SMIC's 65nm capacity expansion implementation is ongoing to meet increasing customer demand. Currently, SMIC's 65-nm MPW service is available every other month throughout 2010. Customers who are interested may contact our SMIC sales or our MPW service representative at Jason_Lu@smics.com.

 

    Highlights:

    -- Comprehensive IP Solution (including robust RF, PDK and DFM and also

       spice-model are available) makes customization easy and cost-effective.

    -- I/O options: 1.8V/2.5V/3.3V & Triple Gate Oxide (Core & 2 I/O's)

       available. For 2.5V I/O it has the option to overdrive to 3.3 or under- 

       drive to 1.8V to meet a broad range of product requirements.

    -- 65LL and 65G share most of the process steps except that 65G has an SMT

       module for NMOS performance enhancement.

    -- 55-nm cost reduction flow is in development, significant improvement is

       expected to achieve by the end of 2010.

    -- Metal options: Up to 10 Cu layers

    -- More than 10 customers in development and production

    -- MPW prototyping running every other month.

    -- Higher speed, lower leakage and smaller in size.

 

 

    About SMIC

    Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit (IC) foundry and technology services at 0.35um to 45/40nm. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its Beijing mega-fab, a 200mm wafer fab in Tianjin, a 200mm fab under construction in Shenzhen, and an in-house assembly and testing facility in Chengdu. SMIC also has customer service and marketing offices in the U.S., Europe, and Japan, and a representative office in Hong Kong. In addition, SMIC manages and operates a 200mm wafer fab in Chengdu owned by Cension Semiconductor Manufacturing Corporation and a 300mm wafer fab in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation. For more information, please visit http://www.smics.com. 

 

    SAFE HARBOUR STATEMENTS

    (Under the Private Securities Litigation Reform Act of 1995)

    This press release contains, in addition to historical information, "forward-looking statements" within the meaning of the "safe harbor" provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on SMIC's current assumptions, expectations and projections about future events. SMIC uses words like "believe," "anticipate," "intend," "estimate," "expect," "project" and similar expressions to identify forward-looking statements, although not all forward-looking statements contain these words. These forward-looking statements involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC's actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements, including among others risks associated with the current global financial crisis, orders or judgments from pending litigation and financial stability in end markets.

    Investors should consider the information contained in SMIC's filings with the U.S. Securities and Exchange Commission (SEC), including its Annual Report on Form 20-F filed with the SEC on June 29, 2010, especially in the "Risk Factors" and "Management's Discussion and Analysis of Financial Condition and Results of Operations" sections, and such other documents that SMIC may file with the SEC or SEHK from time to time, including on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on SMIC's future results, performance or achievements. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this press release may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated, or if no date is stated, as of the date of this press release. Except as may be required by law, SMIC undertakes no obligation and does not intend to update any forward-looking statement, whether as a result of new information, future events or otherwise.

 

    SMIC Press Contacts:

 

     SMIC Shanghai

     Peter Lin

     Public Relations

     Tel:   +86-21-3861-0000 x12349

     Email： Peter_LHH@smics.com

 

     SMIC Shanghai

     Angela Miao

     Public Relations

     Tel:   +86-21-3861-0000 x10088

     Email: Angela_Miao@smics.com

 

SOURCE Semiconductor Manufacturing International Corporation

 

 

中芯国际65纳米技术成功进入量产阶段

 

    上海2010年8月3日电 /美通社亚洲/ -- 中芯国际集成电路制造有限公司（“中芯国际”，纽约证券交易所：SMI，香港联交所交易代码：0981.HK），作为世界领先的半导体代工厂，也是最中国内地最先进的半导体制造商今天宣布，其自2009年第三季开始在中芯国际北京12寸厂生产的65纳米技术晶圆出货累计已超过10,000片，目前已成功进入量产。

 

    中芯目前拥有超过10个 FOT (Foundry Owned-Tooling) 和 COT(Customer Owned-Tooling) 客户在各个开发以及生产阶段。中芯国际的65纳米逻辑技术显著改善产品集成度，并具有高性能，低功耗以及尺寸更小的高水平。目前涉及的产品应用包括 Wi - Fi，蓝牙，高清电视，影音解码器，应用处理器以及 TD-SCDMA 芯片。65纳米工艺由中芯国际设计服务部门秉持严格的设计标准为客户提供具有符合 DFM 标准的产品和服务。除了中芯国际自主设计的 IP，中芯完整的解决方案也包含了第三方 IP。综合 IP 解决方案为客户提供灵活的优势，以简化设计流程，缩短设计时间，让客户产品能够更快打地入市场。

 

    从65纳米过渡到55纳米技术也正在开发中，中芯55纳米技术按照65纳米制程(包含输入输出和模拟电路)作90%的线性比例缩小。“中芯国际的65纳米设计可以为目前65纳米客户提供未来提升到55纳米的方便以及益处，中芯国际的65/55-nm 项目小组的进展如火如荼，”中芯国际资深副总裁兼首席商务官季克非表示。“我们的65纳米技术为我们的先端客户提供前所未有的机遇，能帮助先端客户进一步巩固在各自行业的领导地位。中芯65纳米使芯片尺寸大幅减小，耗能度改善，速度提升以及低漏电的特性，能为中芯国际客户提供具有高度差异化的产品以进一步打入市场。”

 

    因应日益剧增的客户需求中芯国际的65纳米产能扩充计划持续进行中。目前中芯为客户提供每两个月一次的65纳米多项目晶圆服务。有兴趣的客户可联系销售代表，或者直接联系多项目晶圆服务代表 Jason_Lu@smics.com。

 

    中芯国际65纳米汇萃

·         全面的 IP 解决方案（包括 RF, PDK and DFM），能更节省客户设计成本以及方便客户根据产品定制调试 IP 方案。

·         I/O 选择包含：1.8V/2.5V/3.3V & Triple Gate Oxide (1个核心以及2个 I/O) 。关于2.5V 的 I/O 可以有额外驱使到3.3V 或者降低到1.8V 的选择以满足客户广泛产品不同的需求。

·         65LL and 65G 基本制程一致，不过65G 具备额外增强性能的 NMOS 模块。

·         中芯55纳米低成本的技术正在开发中，年底将有突破性进展。

·         金属选项：多达10个铜金属层。

·         中芯目前有10个以上的 FOT 以及 COT 客户进入各个开发以及生产阶段。

·         为客户提供每两个月一次的65纳米多项目晶圆服务。

·         芯片尺寸大幅减小，耗能度改善，速度提升以及低漏电等特性。

 

    关于中芯国际

    中芯国际集成电路制造有限公司（“中芯国际”，纽约证交所股票代码：SMI，香港联合交易所股票代码：981），是世界领先的集成电路芯片代工企业之一，也是中国内地规模最大、技术最先进的集成电路芯片代工企业。中芯国际向全球客户提供0.35微米到45/40纳米芯片代工与技术服务。中芯国际总部位于上海，在上海建有一座300mm 芯片厂和三座200mm 芯片厂。在北京建有两座300mm 芯片厂，在天津建有一座200mm 芯片厂，在深圳有一座200mm 芯片厂在兴建中，在成都拥有一座封装测试厂。中芯国际还在美国、欧洲、日本提供客户服务和设立营销办事处，同时在香港设立了代表处。此外，中芯代成都成芯半导体制造有限公司经营管理一座200mm 芯片厂，也代武汉新芯集成电路制造有限公司经营管理一座300mm 芯片厂。详细信息请参考中芯国际网站 http://www.smics.com 

 

    安全港声明（根据1995私人有价证券诉讼改革法案）

    本次新闻发布可能载有（除历史资料外）依据1995美国私人有价证券诉讼改革法案的“安全港”条文所界定的“前瞻性陈述”。该等前瞻性陈述乃根据中芯对未来事件的现行假设、期望及预测而作出。中芯使用“相信”、“预期”、“打算”、“估计”、“期望”、“预测”或类似的用语来标识前瞻性陈述，尽管并非所有前瞻性声明都包含这些用语。这些前瞻性声明涉及可能导致中芯实际表现、财务状况和经营业绩与这些前瞻性声明所表明的意见产生重大差异的已知和未知的重大风险、不确定因素和其他因素，其中包括当前全球金融危机的相关风险、未决诉讼的颁令或判决，和终端市场的财政稳定。

 

    投资者应考虑中芯呈交予美国证券交易委员会（“证交会”）的文件资料，包括其于二零一零年六月二十九日以20-F 表格形式呈交给证交会的年报，特别是在“风险因素”和“管理层对财务状况和经营业绩的讨论与分析”部分，并中芯不时向证交会(包括以6-K 表格形式)，或联交所呈交的其他文件。其它未知或不可预测的因素也可能对中芯的未来结果，业绩或成就产生重大不利影响。鉴于这些风险，不确定性，假设及因素，本次新闻发布中讨论的前瞻性事件可能不会发生。请阁下审慎不要过分依赖这些前瞻性声明，因其只于声明当日有效，如果没有标明声明的日期，就截至本新闻发布之日。除法律有所规定以外，中芯概不负责因新资料、未来事件或其他原因引起的任何情况，亦不拟，更新任何前瞻性陈述。

 

    欲知详情，请联系：

 

    中芯国际媒体联络：

    林学恒

    中芯国际公关处

    电话：+86-21-3861-0000 转12349

    邮件：Peter_LHH@smics.com

 

    缪为夷
    中芯国际公关处
    电话：+86-21-3861-0000 转10088

    邮件：Angela_Miao@smics.com

 

消息来源 中芯国际



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