光電廠風險分析: Semi Fab Risk: Earthquakes, Fire ...

光電廠風險分析: Semi Fab Risk: Earthquakes, Fire ...

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Description: CAUSES OF INCIDENT LOSS AT SEMICONDUCTOR FABS. CAUSES OF FIRE, EXPLOSION, FLUID LEAKAGE .. Process tools involved: wet bench furnace stepper etcher ion implanter.

Operator contractor equipment error sources. .

 
Author: 蕭世欽 (Fellow) | Visits: 1737 | Page Views: 2504
Domain:  Business Category: Management Subcategory: Risk Management 
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Contents:
�~�� 85.10.14 86

���q -

�_���I Wet bench (overheated) A fire occurred in a PP plating line. The cause was an over heated heating coil due to low water level. Toxic exhaust duct with Silane/Hydrogen gas (self-ignited during hot work operation Gel mixing tank (static electric) Steam boiler fire (diesel residue in the untreated welding place) and burned the neighboring plastic duct Special gas room (Silane leaked during the loading/unloading)

�l�����B

(�� 79 14

NT$)

86.10.03

-

102

94 95.5.1

-

10 80

96.11.23

-

15

year

Fire History

Loss Amount (US$) 4.3 M

1986 Hot plated ignited PP wet bench. Fire spread into 24" diameter metal main duct through 10" diameter PP exhaust duct 1988 A fire occurred in the electronic section of wafer stepper 1988 A fire occurred in the stainless steel exhaust duct at a chemical vapour deposition furnace. The cause was the auto-ignition of pyrophoric gas (probably phosphire) that involved vacuum pump oil deposits either in the stack or on a fan. 1994 Overheated brake resistor in a motor controller of a spin rinse dryer ignited a PP shell over the controller 1995 Overheated electric heater caused a fire. In the bath contained photoresist stripper. Stripper leaking through a crack in the bath may have caused the heater to overheat by short circuiting 8 of the 12 heating strips.

1.9 M 5.7 M

9M

10.8 M

CAUSES OF INCIDENT AT SEMICONDUCTOR FABS (1977-1997)

FIRE
7% 19% 47%

EXPLOSION

FLUID LEAKAGE

SERVICE INTERRUPTION
22% 5%

MISCELLANEOUS

CAUSES OF FIRE AT SEMICONDUCTOR FABS (1977-1997)

11% 27%

32% 30%

PR OCESS L IQUID HEATERS ELEC TRICAL COMPONENTS FLAMMABLE/PYROP HORIC GASES MISC.

CAUSES OF FLUID LEAKAGE AT SEMICONDUCTOR FABS

(1977-1997)

10%

7%

DEFECTIVE/INADEQUA TE EQUPMENT I CONTRACTOR ERROR OPERATOR ERROR

17% 66%

MISC.

PROCESS TOOLS INVOLVED IN INCIDENTS (1977-1997)
7% 8% 8%

17%

60%

wet be nch

furance

steppe r

etcher

ion implanter

SUPPORT EQUIPMENTS INVOLVED IN INCIDENTS (1977-1997)
45 40 35 30 25 Number of incidents 20 15 10 5 0 Fume ductwork HVAC Transformer gas cabinet scrubber DI water Vacuum pump MCC

(1995-2004)
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Inspection

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Attached by the electric manufacturing plants Exposed to the plastic extrusion plant Attached by the plastic extrusion area

(Clean Room/AOI/Computer)

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(94�� ����H���ݱj�_

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(�̹L

(-��� /WET BENCH/Stripper/�k���

)

.

(flaming drip)

HAZARD GAS
CVD - SiH4(1.4-96%, flammable/ pyrophoric) - H2 (4-74%,Flammable gas) - PH3 (1.6-98%, flam./pyrophoric/toxic) - NH3 (16-28%, flam./toxic/corrosive) - N2O (oxidizer) Etching - CL2/HCL(toxic/corrosive) - NF3 (toxic) - BCL3 (toxic/corrosive) - CF4 (toxic/corrosive) )

FLAMMABLE LIQUID
IPA(2-12%,flammable liquid) Acetone(2.7-13.2%, flammable liquid) Photo-resistor (flammable liquid)

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